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APL3204A/B
Li+ Charger Protection IC
Features
* * * * * * * * * *
Input Over-Voltage Protection Programmable Input Over-Current Protection Battery Over-Voltage Protection Over-Temperature Protection High Immunity of False Triggering High Accuracy Protection Thresholds Fault Status Indication Enable Input Available in TDFN4x3-12 Package Lead Free and Green Devices Available (RoHS Compliant)
General Description
The APL3204A/B provide complete Li+ charger protections against over-voltage, over-current, and battery overvoltage. The IC is designed to monitor input voltage, input current, and battery voltage. When any of the monitored parameters are over the threshold, the IC removes the power from the charging system by turning off an internal switch. All protections also have deglitch time against false triggering due to voltage spikes or current transients. The APL3204A/B also provide over-temperature protection, a FAULT output pin to indicate the fault conditions, and the EN pin to allow the system to disable the IC.
Simplified Application Circuit
Applications
* *
Smart Phones and PDAs Digital Still Cameras Potable Devices
5V Adapter or USB IN OUT
Charger Input
*
APL3204A/B EN FAULT Charger Output and System ILIM GND Li+ Battery BAT
Pin Configuration
IN 1 IN 2 GND 3 EP FAULT 4 NC 5 NC 6 9 ILIM 8 BAT 7 EN 12 NC 11 OUT 10 OUT
TDFN4X3-12 (Top View)
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright (c) ANPEC Electronics Corp. Rev. A,1 - Jun, 2008 1 www.anpec.com.tw
APL3204A/B
Ordering and Marking Information
APL3204A APL3204B Assembly Material Handling Code Temperature Range Package Code Package Code QB : TDFN4x3-12 Operating Ambient Temperature Range I : -40 to 85 oC Handling Code TR : Tape & Reel Assembly Material L : Lead Free Device G : Halogen and Lead Free Device XXXXX - Date Code
APL3204A QB:
L04A XXXXX
APL3204B QB:
L04B XXXXX
XXXXX - Date Code
Note : ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD020C for MSL classification at lead-free peak reflow temperature. ANPEC defines "Green" to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight).
Absolute Maximum Ratings
Symbol VIN VOUT, VBAT VILIM, VFAULT , VEN, IOUT TJ TSTG TSDR
(Note 1)
Rating -0.3 to 30 -0.3 to 7 -0.3 to 7 2 150 -65 to 150 260 Unit V V V A
o o
Parameter IN Input Voltage (IN Pin to GND) OUT, BAT Pins to GND Voltage ILIM, FAULT, EN, Pins to GND Voltage OUT Output Current Maximum Junction Temperature Storage Temperature Range Maximum Lead Soldering Temperature,10 Seconds
C
C C
o
Note 1 : Stresses beyond the absolute maximum rating may damage the device and exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Thermal Characteristics
Symbol Parameter Junction to Ambient Thermal Resistance in Free Air TDFN4x3-12 80 Typical Value Unit C/W
JA
Recommended Operating Conditions
Symbol VIN IOUT TJ TA IN Input Voltage OUT Output Current Junction Temperature Ambient Temperature Parameter Range 4.5 to 5.5 0 to 1.5 -40 to 125 -40 to 85 Unit V A C C
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APL3204A/B
Electrical Characteristics
Refer to the typical application circuit. These specifications apply over VIN=5V, TA= -40~85C, unless otherwise specified. Typical values are at TA=25C.
Symbol Parameter Test Conditions APL3204A/B Min. Typ. Max. Unit
POWER-ON-RESET (POR) AND SUPPLY CURRENT VPOR IN POR Threshold IN POR Hysteresis EN = Low ICC TB(IN) IN Supply Current Input Power-On Blanking Time EN = High VIN rising to VOUT rising VIN rising 2.5 230 250 100 8 2.8 350 150 V mV A ms
INTERNAL POWER SWITCH AND OUT DISCHARGE RESISTANCE Power Switch On Resistance OUT Discharge Resistance INPUT OVER-VOLTAGE PROTECTION (OVP) VOVP Input OVP Threshold Input OVP Recovery Hysteresis Input OVP Propagation Delay TON(OVP) Input OVP Recovery Time APL3204A, VIN rising APL3204B, VIN rising 5.67 6.60 5.85 6.80 200 8 6.00 7.00 1 V mV s ms IOUT = 0.5A VOUT = 3V 250 500 450 m
OVER-CURRENT PROTECTION (OCP) IOCP OCP Threshold OCP Threshold Accuracy TB(OCP) TON(OCP) OCP Blanking Time OCP Recovery Time RILIM = 25k IOCP = 300mA to 1500mA 930 -10 1000 176 64 1070 +10 mA % s ms
BATTERY OVER-VOLTAGE PROTECTION VBOVP Battery OVP Threshold Battery OVP Hysteresis IBAT TB(BOVP) BAT Pin Leakage Current Battery OVP Blanking Time VBAT = 4.4V VBAT rising 4.30 4.35 270 176 4.4 20 V mV nA s
EN LOGIC LEVELS EN Input Logic High EN Input Logic Low EN Internal Pull-Low Resistor FAULT LOGIC LEVELS AND DELAY TIME FAULT Output Low Voltage FAULT Pin Leakage Current OVER-TEMPERATURE PROTECTION (OTP) TOTP Over-Temperature Threshold Over-Temperature Hysteresis 140 20 C C Sink 5mA current VFAULT = 5V 0.4 1 V A 1.4 500 0.4 V V k
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APL3204A/B
Typical Operating Characteristics
Input OVP Threshold vs. Junction Temperature
6.00 APL3204A
7.00
Input OVP Threshold vs. Junction Temperature
Input OVP Threshold , VOVP (V)
6.95 6.90 6.85 6.80 6.75 6.70 6.65 6.60 6.55 6.50 -50 -25 0 25 50 75 100 125 VIN Decreasing VIN Increasing APL3204B
Input OVP Threshold , VOVP (V)
5.95 5.90 5.85 5.80 5.75 5.70 5.65 5.60 5.55 -50 -25 0 25 50 75 100 125 VIN Decreasing VIN Increasing
Junction Temperature
( oC )
Junction Temperature (oC )
Battery OVP Threshold vs. Junction Temperature
4.40
OCP Threshold vs. Junction Temperature
1200 1150
Battery OVP Threshold, VBOVP (V)
4.35 4.30 4.25 4.20 4.15 4.10 VBAT Decreasing 4.05 4.00 -50 -25 0 25 50 75 100 125
OCP Threshold, IOCP (mA)
VBAT Increasing
1100 1050 1000 950 900 850 800 -50 -25 0 25 50 75 100 125
Junction Temperature (oC)
Junction Temperature
(oC)
IN Supply Current vs. Junction Temperature
150
2.80 2.70 2.60 2.50 2.40
POR Threshold vs. Junction Temperature
IN Supply Current, ICC ()
125
100 EN = high
POR Threshold, VPOR (V)
VIN Increasing
75
VIN Decreasing 2.30
50 -50 -25 0 25 50 75 100 125
2.20 -50 -25 0 25 50 75 100 125
Junction Temperature
(oC)
Junction Temperature
(oC)
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APL3204A/B
Typical Operating Characteristics (Cont.)
Power Switch On Resistance vs. Input Voltage
Power Switch On Resistance, RDS,ON (m)
Power Switch On Resistance vs. Junction Temperature
400
Power Switch On Resistance, RDS,ON ()
0.35
0.30
350
0.25
300
0.20
250
0.15
200
0.10 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5
150 -50 -25 0 25 50 75
o
100
125
Input Voltage, VIN (V)
Junction Temperature ( C)
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APL3204A/B
Operating Waveforms
Refer to the typical application circuit. The test condition is VIN=5V, TA= 25oC unless otherwise specified.
Normal Power On
VIN = 0 to 5V VIN 1 VOUT
1 VIN = 0 to 12V VIN
OVP at Power On
VOUT
2 IOUT
2
VFAULT
3
3
COUT =1F, CIN =1F, ROUT = 10 CH1: VIN, 5V/Div, DC CH2: VOUT, 2V/Div, DC CH3: IOUT, 0.5A/Div, DC TIME: 2ms/Div
COUT =1F, CIN =1F, ROUT = 10 CH1: VIN, 10V/Div, DC CH2: VOUT, 2V/Div, DC CH3: VFAULT, 5V/Div, DC TIME: 2ms/Div
Input Over-Voltage Pretection
APL3204B VIN 1
Input Over-Voltage Pretection
APL3204A VIN
1 VOUT
VOUT
3 2 VFAULT
3 2 VFAULT
VIN= 5V to 12V COUT = 1F, CIN=1F, ROUT=50 CH1: VIN, 5V/Div, AC CH2: VOUT, 2V/Div, DC CH3: VFAULT, 5V/Div, DC TIME:20s/Div
COUT = 1F, CIN=1F, ROUT=50 CH1: VIN, 5V/Div, AC CH2: VOUT, 2V/Div, DC CH3: VFAULT, 5V/Div, DC TIME: 20s/Div
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APL3204A/B
Operating Waveforms (Cont.)
Refer to the typical application circuit. The test condition is VIN=5V, TA= 25oC unless otherwise specified.
Recovery from Input OVP
APL3204B VIN
VBAT
Battery Over-Voltage Pretection
1
1 VOUT
VOUT 2
2
VFAULT 3
VFAULT 3
VIN= 12V to 5V COUT = 1F, CIN=1F, ROUT=50 CH1: VIN, 5V/Div, AC CH2: VOUT, 5V/Div, DC CH3: VFAULT, 5V/Div, DC TIME: 2ms/Div
VBAT = 3.6V to 4.4V to 3.6V, ROUT=33.3 COUT =1F, CIN =1F CH1: VBAT, 2V/Div, DC CH2: VOUT, 2V/Div, DC CH3: VFAULT, 5V/Div, DC TIME: 5ms/Div
Battery Over-Voltage Pretection
Recovery from Battery OVP
VBAT
VBAT
1
VOUT
1 VOUT
2
2
VFAULT 3
VFAULT 3
VBAT = 3.6V to 4.4V, R OUT=33.3 COUT =1F, CIN =1F CH1: VBAT, 2V/Div, DC CH2: VOUT, 2V/Div, DC CH3: VFAULT, 5V/Div, DC TIME: 50s/Div
VBAT = 4.4V to 3.6V, ROUT=33.3 COUT =1F, CIN =1F CH1: VBAT, 2V/Div, DC CH2: VOUT, 2V/Div, DC CH3: VFAULT, 5V/Div, DC TIME: 50s/Div
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APL3204A/B
Operating Waveforms (Cont.)
Refer to the typical application circuit. The test condition is VIN=5V, TA= 25oC unless otherwise specified.
Over-Current Pretection
Over-Current Pretection
IOUT 1
VIN 1 2 VOUT
VOUT
2
IOUT 3
VFAULT 3
4 VFAULT
COUT =1F, CIN =1F, IOUT = 0.5A to 1.2A CH1: IOUT, 0.5A/Div, DC CH2: VOUT, 2V/Div, DC CH3: VFAULT, 5V/Div, DC TIME: 50s/Div
COUT =1F, CIN =1F, ROUT = 2.5 CH1: VIN, 5V/Div, DC CH2: VOUT, 5V/Div, DC CH3: IOUT, 0.5A/Div, DC CH4: VFAULT, 5V/Div, DC TIME: 200ms/Div
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APL3204A/B
Pin Description
PIN FUNCTION NO. 1,2 3 5,6,12 4 7 8 9 10,11 NAME IN GND NC FAULT EN BAT ILIM OUT EP Power Supply Input. Ground. No Connection. Fault Indication Pin. This pin goes low when input OVP, OCP, or battery OVP is detected. Enable Input. Pull this pin to high to disable the device and pull this pin to low to enable device. Battery OVP Sense Pin. Connect to positive terminal of battery through a resistor. Over-current Protection Setting Pin. Connect a resistor to GND to set the over-current threshold. Output Voltage Pin. The output voltage follows the input voltage when no fault is detected. Exposed Thermal Pad. Must be electrically connected to the GND pin.
Block Diagram
IN
OUT
POR ILIM Charge Pump
0.5V
Gate Driver and Control Logic
1.2V
1V BAT FAULT
OTP
EN
GND
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APL3204A/B
Typical Application Circuit
5V Adapter/ USB 1F APL3204A/B FAULT 4 50K VIO MCU 50K 7 EN 25K 9 ILIM GND 3 8 BAT 100K Li+ Battery 50K GPIO
1, 2 IN OUT
10, 11 1F
Charger
Figure 1. The Typical Protection Circuit for Charger Systems.
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APL3204A/B
Function Description
Power-Up The APL3204A/B have a built-in power-on-reset circuit to keep the output shuting off until internal circuitry is operating properly. The POR circuit has hysteresis and a deglitch feature so that it will typically ignore undershoot transients on the input. When input voltage exceeds the POR threshold and after 8ms blanking time, the output voltage starts a soft-start to reduce the inrush current. Input Over-Voltage Protection (OVP) The input voltage is monitored by the internal OVP circuit. When the input voltage rises above the input OVP threshold, the internal FET will be turned off within 1s to protect connected system on OUT pin. When the input voltage returns below the input OVP threshold minus the hysteresis, the FET is turned on again after 8ms recovery time. The input OVP circuit has a 200mV hysteresis and a recovery time of TON(OVP) to provide noise immunity against transient conditions. Over-Current Protection (OCP) The output current is monitored by the internal OCP circuit. When the output current reaches the OCP threshold, the device limits the output current at OCP threshold level. If the OCP condition continues for a blanking time of TB(OCP), the internal power FET is turned off. After the recovery time of TON(OCP), the FET will be turned on again and the output current is monitored again. The APL3204A/B have a built-in counter. When the total count of OCP fault reaches 16, the FET is turned off permanently, requiring either a VIN POR or EN re-enable again to restart. The OCP threshold is programmed by a resistor RILIM connected from ILIM pin to GND. The OCP threshold is calculated by the following equation:
IOCP = KILIM RILIM
the internal power FET is turned off. When the BP voltage returns below the battery OVP threshold minus the hysteresis, the FET is turned on again. The APL3204A/B have a built-in counter. When the total count of battery OVP fault reaches 16, the FET is turned off permanently, requiring either a VIN POR or EN re-enable again to restart. Over-Temperature Protection When the junction temperature exceeds 140C, the internal thermal sense circuit turns off the power FET and allows the device to cool down. When the device' juncs tion temperature cools by 20C, the internal thermal sense circuit will enable the device, resulting in a pulsed output during continuous thermal protection. Thermal protection is designed to protect the IC in the event of over temperature conditions. For normal operation, the junction temperature cannot exceed TJ=+125 C. FAULT Output The APL3204A/B provide an open-drain output to indicate that a fault has occurred. When any of input OVP, OCP, battery OVP, is detected, the FAULT goes low to indicate that a fault has occurred. Since the FAULT pin is an open-drain output, connecting a resistor to a pull high voltage is necessary. Enable/Shutdown Pull the EN pin voltage above 1.4V to disable the device and pull EN pin voltage below 0.4V to enable the device. The EN pin has an internal pull-down resistor and can be left floating. When the IC is latched off due to the total count of OCP or battery OVP reaches 16, disable and reenable the device with the EN pin can clear the counter.
where KILIM=25000A Battery Over-Voltage-Protection The APL3204A/B monitor the BAT pin voltage for battery over-voltage protection. The battery OVP threshold is internally set to 4.35V. When the BAT pin voltage exceeds the battery OVP threshold for a blanking time of TB(BOVP),
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APL3204A/B
Function Description (Cont.)
VOVP
VPOR VIN
VOUT
VFAULT
TB(IN)
TON(OVP)
Figure2. OVP Timing Chart
VOUT OCP Threshold Count 13 times
IOUT
VFAULT Total count 16 times IC is latched off
TB(OCP)
TON(OCP)
TB(OCP)
TB(OCP)
Figure 3 OCP Timing Chart
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APL3204A/B
Function Description (Cont.)
VBAT
VBOVP VBOVP
VBOVP
Count 13 times VOUT
VFAULT
TB(BOVP)
TB(BOVP)
TB(BOVP)
Total count 16 times IC is latched off
Figure 4. Battery OVP Timing Chart
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APL3204A/B
Application Information
RBAT Selection Connect the BAT pin to the positive terminal of battery through a resistor RBAT for battery OVP function. The RBAT limits the current flowing from BAT to battery in case of BAT pin is shorted to VIN pin under a failure mode. The recommended value of RBAT is 100k. In the worse case of an IC failure, the current flowing from the BAT pin to the battery is: (30V-3V)/ 100k =270A where the 30V is the maximum IN voltage and the 3V is the minimum battery voltage. The current is so small and can be absorbed by the charger system. The disadvantage with the large RBAT is that the error of the battery OVP threshold will be increased. The additional error is the voltage drop across the RBAT because of the BAT bias current. When RBAT is 100k, the worsecase additional error is 100kx20nA=2mV, which is acceptable in most applications. REN Selection For the same reason as the BAT pin case, the EN pin should be connected to the MCU GPIO pin through a resistor. The value of the REN is dependent on the IO voltage of the MCU. Since the IO voltage is divided by REN and EN internal pull low resistor for EN voltage. It has to be ensured that the EN voltage is above the EN logic high voltage when the GPIO output of the MCU is high. FAULT Output Since the FAULT pin is an open-drain output, connecting a resistor RUP to a pull high voltage is necessary. It is also recommended that connect the FAULT to the MCU GPIO through a resistor RFAULT. The RFAULT prevents damage to the MCU under a failure mode. The recommended value of the resistors should be between 10k to 100k. Capacitor Selection The input capacitor is for decoupling and prevents the input voltage from overshooting to dangerous levels. In the AC adapter hot plug-in applications or load current step-down transient, the input voltage has a transient spike due to the parasitic inductance of the input cable. A 25V, X5R, dielectric ceramic capacitor with a value between 1F and 4.7F placed close to the IN pin is recommended. The output capacitor is for output voltage decoupling, and also can be as the input capacitor of the charging circuit. At least, a 1F, 10V, X5R capacitor is recommended. Layout Consideration In some failure modes, a high voltage may be applied to the device. Make sure the clearance constraint of the PCB layout must satisfy the design rule for high voltage. The exposed pad of the TDFN4x3-12 performs the function of channeling heat away. It is recommended that connect the exposed pad to a large copper ground plane on the backside of the circuit board through several thermal vias to improve heat dissipation. The input and output capacitors should be placed close to the IC. RILIM also should be placed close to the IC. The high current traces like input trace and output trace must be wide and short.
EN REN GPIO BAT RBAT RFAULT GPIO FAULT RUP VIO
MCU
Li+ Battery
Figure 5. RUP, RFAULT, REN and RBAT
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APL3204A/B
Package Information
TDFN4x3-12
E A
D
E2
Pin 1 Corner D2
A1 A3
L S Y M B O L A A1 A3 b D D2 E E2 e L K 0.30 0.20 1.40 0.50 BSC 0.50 0.012 0.008 Note : Follow JEDEC MO-229 WGED-4. 3.00 3.00 BSC 1.80 0.055 0.020 BSC 0.020 0.18 4.00 BSC 3.70 0.118 0.118 BSC 0.071 TDFN4x3-12 MILLIMETERS MIN. 0.70 0.00 0.20 REF 0.30 0.007 0.157 BSC 0.146 MAX. 0.80 0.05 MIN. 0.028 0.000 0.008 REF 0.012 INCHES MAX. 0.031 0.002
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APL3204A/B
Carrier Tape & Reel Dimensions
OD0
P0
P2
P1
A E1 F
K0 B SECTION A-A
B0
A0
OD1 B
A
SECTION B-B
T
d
Application
A
H
H A
T1
T1
C
d
D
W
E1
W
F 5.5O .05 0 K0
330.0O .00 50 MIN. 2 TDFN3x4-12 P0 4.0O .20 0 P1 8.0O .10 0
12.4+2.00 13.0+0.50 0 0 -0.00 -0.20 1.5 MIN. 20.2 MIN. 12.0O .30 1.75O .10 P2 2.0O .05 0 D0 1.5+0.10 -0.00 D1 1.5 MIN. T 0.6+0.00 -0.40 A0 3.7O .20 0 B0
4.7O .20 1.30O .20 0 0 (mm)
Devices Per Unit
Package Type TDFN4x3-12 Unit Tape & Reel Quantity 3000
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APL3204A/B
Reflow Condition
TP
(IR/Convection or VPR Reflow)
tp Critical Zone TL to TP Ramp-up
TL
Temperature
tL Tsmax
Tsmin Ramp-down ts Preheat
25
t 25C to Peak
Reliability Test Program
Test item SOLDERABILITY HOLT PCT TST ESD Latch-Up Method MIL-STD-883D-2003 MIL-STD-883D-1005.7 JESD-22-B,A102 MIL-STD-883D-1011.9 MIL-STD-883D-3015.7 JESD 78
Time
Description 245C, 5 sec 1000 Hrs Bias @125C 168 Hrs, 100%RH, 121C -65C~150C, 200 Cycles VHBM > 2KV, VMM > 200V 10ms, 1tr > 100mA
Classification Reflow Profiles
Profile Feature Average ramp-up rate (TL to TP) Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts) Time maintained above: - Temperature (TL) - Time (tL) Peak/Classification Temperature (Tp) Time within 5C of actual Peak Temperature (tp) Ramp-down Rate Time 25C to Peak Temperature Sn-Pb Eutectic Assembly 3C/second max. 100C 150C 60-120 seconds 183C 60-150 seconds See table 1 10-30 seconds 6C/second max. 6 minutes max. Pb-Free Assembly 3C/second max. 150C 200C 60-180 seconds 217C 60-150 seconds See table 2 20-40 seconds 6C/second max. 8 minutes max.
Note: All temperatures refer to topside of the package. Measured on the body surface.
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APL3204A/B
Classification Reflow Profiles (Cont.)
Table 1. SnPb Eutectic Process - Package Peak Reflow Temperatures Package Thickness <2.5 mm 2.5 mm Volume mm <350 240 +0/-5C 225 +0/-5C
3
Volume mm3 350 225 +0/-5C 225 +0/-5C
Table 2. Pb-free Process - Package Classification Reflow Temperatures Volume mm Volume mm Volume mm <350 350-2000 >2000 <1.6 mm 260 +0C* 260 +0C* 260 +0C* 1.6 mm - 2.5 mm 260 +0C* 250 +0C* 245 +0C* 2.5 mm 250 +0C* 245 +0C* 245 +0C* * Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated classification temperature (this means Peak reflow temperature +0C. For example 260C+0C) at the rated MSL level. Package Thickness
3 3 3
Customer Service
Anpec Electronics Corp. Head Office : No.6, Dusing 1st Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 2F, No. 11, Lane 218, Sec 2 Jhongsing Rd., Sindian City, Taipei County 23146, Taiwan Tel : 886-2-2910-3838 Fax : 886-2-2917-3838
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